[News] Broadcom Reportedly Boosts 2026 CoWoS Orders with Foundries on Strong ASIC Demand

With NVIDIA’s latest earnings underscoring the AI infrastructure boom, investor focus is also shifting to ASIC demand. According to the Commercial Times, Broadcom has lifted its CoWoS packaging orders for next year, a move likely fueled by rising custom chip needs from Google, Meta, and other cloud giants.

As Commercial Times suggests, foundries are already seeking 2026 forecasts, with Broadcom raising its CoWoS packaging orders for that year. In June, Reuters reported the U.S. chipmaker guided Q3 revenue to around $15.8B, driven by strong demand for networking gear and custom AI chips. Broadcom, as Reuters highlights, designs specialized processors for AI and cloud players such as OpenAI and Google.

Analysts cited by Commercial Times explain that unlike NVIDIA’s general-purpose GPUs, ASICs offer greater design flexibility and can significantly lower total cost of ownership (TCO) when deployed at scale. For instance, Google’s ASIC designs are said to be tuned for social media algorithms, with customers reportedly including xAI and Meta via Google Cloud.

Taiwanese IC Design Houses Poised to Benefit

Commercial Times suggests that Taiwan’s IC design houses—led by MediaTek and TSMC affiliate GUC—are set to benefit in the trend. MediaTek is said to be working closely with Google on ASIC design for its seventh-generation TPU, which will use a 3nm process, six 12-high HBM3E stacks, and CoWoS-L packaging—potentially driving MediaTek’s growth in Q4 2026, the report adds.

As TrendForce points out, Google leads among US CSPs with its TPU v6 Trillium. Notably, the tech giant has also expanded from a single-supplier model (Broadcom) to a dual-sourcing strategy by partnering with MediaTek to enhance design flexibility, reduce supply chain risk, and support more aggressive adoption of advanced process nodes, as per TrendForce.

On the other hand, TrendForce notes that Meta, having deployed its first in-house AI accelerator MTIA, is now co-developing MTIA v2 with Broadcom. Commercial Times suggests that TSMC affiliate GUC is also providing turnkey services for multiple cloud players—including Meta’s MTIA v3. Some of these projects are slated for mass production in Q4, with volumes expanding in the first half of 2026, the report notes.

Read more

• [News] Meta Reportedly Teams Up with Broadcom, Taps Quanta for Next-Gen ASIC-powered AI servers
• [News] MediaTek Gears Up for 2nm Tape-Out in Sep; ASIC Reportedly to Boost 2026 Revenue

(Photo credit: Broadcom)