[News] Apple’s New MacBook Pro Reportedly Delayed as M5 Shifts to LMC Packaging, Eyes CoWoS Future

According to TechNews, citing TechPowerUp and Wccftech, Apple’s next-generation M5 chips—set to be used in new MacBook Pro models launching in 2026—will reportedly feature a major upgrade in packaging technology, adopting LMC (Liquid Molding Compound) exclusively supplied by Taiwan’s Eternal Materials, laying the groundwork for potential future adoption of TSMC’s CoWoS (Chip-on-Wafer-on-Substrate) technology.

TechPowerUp, citing remarks from a renown analyst, notes that Eternal will reportedly provide MUF (molding underfill) for A20 iPhone packages and LMC for high-end M5 Mac processors. According to the report, citing industry sources, TSMC has completed material qualification, and CoWoS validation is in progress. Notably, Eternal has reportedly beaten Japan’s Namics and Nagase to secure the supply contract, signaling a shift in Apple’s procurement strategy, as indicated by the report.

Apple had reportedly planned to launch the M5 MacBook Pro this fall, but it is now expected to debut in 2026. TechNews indicates the delay may be linked to the transition in packaging technology.

LMC Packaging May Set the Stage for Future CoWoS Adoption

As Wccftech notes, Eternal Materials’ LMC is specifically developed to meet the rigorous requirements of TSMC’s CoWoS packaging, the same standards applied to high-performance computing chips and AI accelerators. CoWoS enables multiple chiplets to be stacked or arranged side by side within a single package, boosting both bandwidth and computational density, the report adds.

While next year’s M5 Macs will not yet feature full CoWoS, Wccftech notes that adoption of compatible materials will still be crucial for future models. The report suggests Apple may be laying the groundwork for upcoming M6 or M7 series chips, which could fully implement CoWoS or even CoPoS (Chip-on-Package-on-Substrate).

If Apple adopts CoWoS in the future, it could allow the company to develop more advanced processors capable of tackling increasingly demanding workloads, from AI model training to high-end 3D rendering, while delivering significantly higher memory throughput, as Wccftech highlights.

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