[News] Samsung May Boost Taylor Investment Beyond $50B, Poised to Be 2nd-Largest Foundry in the U.S.

According to SEDaily, citing industry sources, Samsung’s investment in the Taylor plant could exceed USD 50 billion. The report says the company is reportedly considering reinstating a KRW 10 trillion (approximately USD 7.7 billion) packaging facility project that was excluded from its U.S. investment plans late last year. SEDaily adds that Samsung’s USD 16.5 billion chip deal with Tesla has heightened the need for such a facility, as both chip production and packaging must be completed entirely in the U.S. to avoid tariff pressure.

Wccftech notes that the Korean giant is poised to become the second-largest chipmaker in the U.S., behind TSMC, which could help reduce the foundry division’s operating losses.

Sources cited by SEDaily said Samsung Electronics had initially planned to invest USD 44 billion in its Taylor, Texas plant but reduced the figure to USD 37 billion late last year. The original plan included a 4nm and 2nm foundry, advanced packaging facilities, and an advanced technology R&D center, but the USD 7 billion allocated for packaging was dropped due to difficulties in securing customers at the time.

Investment is projected to grow not only in packaging but also in equipment and materials. Citing a senior executive from a semiconductor materials supplier to the Taylor plant, SEDaily notes that discussions are already underway to increase material supply volumes in anticipation of expanded local investment.

Samsung is also speeding up construction of its Taylor plant, according to SEDaily. As the report points out, by the end of the first quarter Taylor Fab 1 was 91.8% complete, with overall construction scheduled to finish in late October. The cleanroom is expected to be completed by year-end, followed by the installation of semiconductor production equipment starting next year.

Alongside Samsung’s expanded U.S. investments, SK hynix is reportedly advancing its U.S. project. As SEDaily highlights, the company announced last year plans to build an advanced packaging plant for HBM production in West Lafayette, Indiana—an investment of USD 3.87 billion (about KRW 5.4 trillion)—and is now reportedly preparing for groundbreaking. The publication notes that SK hynix aims to begin mass production of next-generation HBM in the second half of 2028 but may accelerate the timeline or expand production beyond packaging, potentially increasing its total investment.

Samsung Electronics and SK hynix are reportedly expected to announce additional U.S. investments at the upcoming South Korea–U.S. summit in Washington, D.C., according to SEDaily.

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(Photo credit: Samsung)