Memory & Storage

Enterprise SSD Contract Price 3Q26 | TrendForce

Enterprise SSD Contract Price 3Q26

Jul 29, 2026 | PDF

Global server demand remains solid, sustaining stable Enterprise SSD orders. As suppliers boost production, improved supply has eased urgent order pressures and moderated quarterly contract price incr...

NAND Flash Market Bulletin - Jul. 29, 2026 | TrendForce

NAND Flash Market Bulletin - Jul. 29, 2026

Jul 29, 2026 | PDF

Steady momentum in AI infrastructure builds is driving robust demand for cloud and server storage, supporting original suppliers in maintaining extremely low inventories and strong pricing leverage. C...

IC and Semi Research Report-3Q26 | TrendForce

IC and Semi Research Report-3Q26

Jul 29, 2026 | PDF

From a professional analyst's perspective, the global semiconductor market is strongly driven by surge in artificial intelligence and cloud computing, boosting high-performance chips and opti...

DRAM Market Bulletin - Jul. 29, 2026 | TrendForce

DRAM Market Bulletin - Jul. 29, 2026

Jul 29, 2026 | PDF

DRAM suppliers are holding firm on pricing, but weaker buyer acceptance has stalled contract negotiations, and spot trading remains thin. Despite softening consumer demand, buyers continue to stockpil...

AI Wave & DRAM Deficits: 2027 Global DRAM Outlook | TrendForce

New AI Wave & DRAM Deficits: 2027 Global DRAM Outlook

Jul 28, 2026 | PDF

Driven by strong demand from cloud service providers, the demand for HBM and server modules has surged. However, constrained by long equipment lead times and capacity reallocation, supply growth conti...

Global Memory Supply-Demand Divergence: Analyzing 2027 DRAM Structural Tightness and NAND Flash Oversupply | TrendForce

Global Memory Supply-Demand Divergence: Analyzing 2027 DRAM Structural Tightness and NAND Flash Oversupply

Jul 28, 2026 | PDF

Driven by robust AI server demand and capacity displacement from HBM, combined with delayed output from new fabs, DRAM supply remains tightly constrained, sustaining a seller's market. Conver...

3Q26 Server Market Report | TrendForce

New 3Q26 Server Market Report

Jul 24, 2026 | PDF

Global Server Market – Trends and Outlook for 3Q26

Smartphone Market Bulletin - Jul. 23, 2026 | TrendForce

Smartphone Market Bulletin - Jul. 23, 2026

Jul 23, 2026 | PDF

In 2027, supply–demand dynamics for DRAM and NAND Flash are expected to diverge. On the one hand, strong pull ins from AI servers will further widen the supply gap for DRAM. On the other hand, for NAN...

NAND Flash Market Bulletin - Jul. 22, 2026 | TrendForce

NAND Flash Market Bulletin - Jul. 22, 2026

Jul 22, 2026 | PDF

Long-term agreements and server demand provide a solid foundation for the contract market, while consumer memory procurement remains conservative due to cost pressures. The spot market saw a brief pri...

DRAM Market Bulletin - Jul. 22, 2026 | TrendForce

DRAM Market Bulletin - Jul. 22, 2026

Jul 22, 2026 | PDF

Server DRAM contract prices are set to rise sharply in 3Q26. Looking to 2027, AI-driven demand growth will outpace supply expansion across all three major DRAM makers, sustaining a tight seller's...

Development of China’s Humanoid Robot Industry: Supply Chain Self-Sufficiency and Challenges for Key Components | TrendForce

New Development of China’s Humanoid Robot Industry: Supply Chain Self-Sufficiency and Challenges for Key Components

Jul 20, 2026 | PDF

Driven by government policy, China’s humanoid robot industry is moving toward standardization and use-case segmentation, focusing on three major technological pillars: embodied AI, motion control, and...

HBM Market Bulletin - Jul. 17, 2026 | TrendForce

HBM Market Bulletin - Jul. 17, 2026

Jul 17, 2026 | PDF

JEDEC-defined SPHBM4 frees HBM from the interposer, trading latency and power for cost and layout.

AI Infra Market Bulletin – Jul. 16, 2026 | TrendForce

AI Infra Market Bulletin – Jul. 16, 2026

Jul 16, 2026 | PDF

As global computing power expands, traditional cabling faces severe thermal and power bottlenecks. Emerging Micro LED CPO technology, with its micron-level size and ultra-low power consumption, has be...

3Q26 HBM Datasheet | TrendForce

3Q26 HBM Datasheet

Jul 15, 2026 | EXCEL

With our expertise in the memory market, this provides a comprehensive analysis and forecast on HBM market share, ASP, wafer capacity, demand consumption, etc.

Overcoming the Memory Bottleneck: CXL Expansion and KV Cache Compression Innovations | TrendForce

New Overcoming the Memory Bottleneck: CXL Expansion and KV Cache Compression Innovations

Jul 15, 2026 | PDF

During the first half of 2026, surging demand for KV Cache coupled with constrained memory supply resulted in severe memory bottlenecks. To resolve the KV Cache bottlenecks, industry players are seeki...

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