No results found. Try adjusting your search or filters.
Global server demand remains solid, sustaining stable Enterprise SSD orders. As suppliers boost production, improved supply has eased urgent order pressures and moderated quarterly contract price incr...
Steady momentum in AI infrastructure builds is driving robust demand for cloud and server storage, supporting original suppliers in maintaining extremely low inventories and strong pricing leverage. C...
From a professional analyst's perspective, the global semiconductor market is strongly driven by surge in artificial intelligence and cloud computing, boosting high-performance chips and opti...
DRAM suppliers are holding firm on pricing, but weaker buyer acceptance has stalled contract negotiations, and spot trading remains thin. Despite softening consumer demand, buyers continue to stockpil...
Driven by strong demand from cloud service providers, the demand for HBM and server modules has surged. However, constrained by long equipment lead times and capacity reallocation, supply growth conti...
Driven by robust AI server demand and capacity displacement from HBM, combined with delayed output from new fabs, DRAM supply remains tightly constrained, sustaining a seller's market. Conver...
Global Server Market – Trends and Outlook for 3Q26
In 2027, supply–demand dynamics for DRAM and NAND Flash are expected to diverge. On the one hand, strong pull ins from AI servers will further widen the supply gap for DRAM. On the other hand, for NAN...
Long-term agreements and server demand provide a solid foundation for the contract market, while consumer memory procurement remains conservative due to cost pressures. The spot market saw a brief pri...
Server DRAM contract prices are set to rise sharply in 3Q26. Looking to 2027, AI-driven demand growth will outpace supply expansion across all three major DRAM makers, sustaining a tight seller's...
Driven by government policy, China’s humanoid robot industry is moving toward standardization and use-case segmentation, focusing on three major technological pillars: embodied AI, motion control, and...
JEDEC-defined SPHBM4 frees HBM from the interposer, trading latency and power for cost and layout.
As global computing power expands, traditional cabling faces severe thermal and power bottlenecks. Emerging Micro LED CPO technology, with its micron-level size and ultra-low power consumption, has be...
With our expertise in the memory market, this provides a comprehensive analysis and forecast on HBM market share, ASP, wafer capacity, demand consumption, etc.
During the first half of 2026, surging demand for KV Cache coupled with constrained memory supply resulted in severe memory bottlenecks. To resolve the KV Cache bottlenecks, industry players are seeki...