Global instability and rising raw materials drive up electronic component costs; AI infrastructure demand boosts memory super cycle, shifting ODMs' negotiation to stable pricing for supply security. Supply chain price pressures spread, high-end MLCC demand surges, suppliers optimize capacity toward premium items and localize in China to cut costs. Market sees easing price declines, with supply stability key.

Key Highlights

• Global instability and rising materials elevate electronic component costs, with AI infrastructure driving memory super cycle, putting ODMs in price pressure.
• ODMs shift negotiation strategy from cost reduction to stable pricing for supply security, avoiding capacity squeeze on consumer items, as seen in firms like Quanta and Foxconn with minimized declines.
• Supply chain price pressures spread, high-end MLCC demand surges, suppliers like Murata and Samsung optimize capacity to premium applications for better profitability.
• Chinese brands push for supply chain localization, with Murata building local material lines in Wuxi to reduce costs and enhance competitiveness using own tech.
• Overall MLCC market sees structural shift, easing price declines, with AI demand and supply stability becoming core for chain layout.

   

Table of Contents

1. Due to Memory and Component Price Hikes, ODMs’ Pivot from Cost Reduction to Price Stability and Supply Assurance in MLCC Contract Negotiations
2. Price Hike Pressure Spreads Across Supply Chain; ODMs Focus on Price Stability or Are Willing to Accept Less Reductions
3. As Price Reduction Pressure Eases, MLCC Suppliers Continue to Optimize Production Capacity Allocation and Material Costs
4. Trendforce's View 

<Total Pages: 3>