Server Market Bulletin - Dec. 26, 2025
Last Modified
2025-12-26
Update Frequency
Biweekly
Format
Looking to 2026, sustained AI infrastructure build-outs will drive server demand. High CAPEX from North American CSPs supports NVIDIA's new platforms and ASICs. While Tier-2 risks exist, robust major CSP demand boosts ODM AI revenues and cements the critical role of liquid cooling solutions.
Key Highlights
- Market Momentum: Continuous AI build-outs in 2026, driven by North American CSPs' high CAPEX, will boost demand for NVIDIA's rack-scale solutions and self-developed ASICs, supporting overall shipment growth.
- Divergent Demand: Major cloud providers remain strong due to integration synergies. However, Tier-2 datacenters or government projects face potential delays due to power infrastructure or funding issues.
- Supply Chain: ODMs expect significantly higher AI revenue shares from new platform ramps. Meanwhile, cooling suppliers are strengthening their positions with CSPs through comprehensive liquid cooling modules.
Table of Contents
- TrendForce's View
- ODM Dynamics
- 2025 YoY Growth in L6 MB Production among ODMs
- CPU, GPU and ASIC Dynamics
- Thermal/Power Related Updates
<Total Pages: 5>

Category: DRAM , Cloud / Edge Computing , Artificial Intelligence , AI/HBM/Server
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