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DRAM Market Bulletin - Aug. 6, 2025
Last Modified
2025-08-06
Update Frequency
Weekly
Format
Contract negotiations see Samsung under pressure, while spot prices hold due to tight supply. Samsung's call highlights HBM3e oversupply and likely price declines. Despite higher mature DRAM prices, Samsung remains committed to advanced process and HBM investment, with its strategy unchanged despite market fluctuations.
Key Highlights
- 3Q25 contract talks are still ongoing, with Samsung under more pricing pressure than peers; DDR4 contract price rises more than DDR5.
- Spot market remains cool but prices stable due to supply tightness; secondhand chip prices dip slightly, reflecting weak 4Q25 demand outlook.
- Samsung’s Q2 briefing highlights robust shipment and price improvement in legacy products, but notes HBM3e oversupply may lead prices down.
- The company commits to investing in advanced processes and HBM, maintaining this strategy regardless of market changes.
- HBM3e and HBM4 ramp-up and validation are ongoing; Samsung prioritizes meeting mid-to-long-term AI demand despite narrowing price gaps.
- Despite HBM share challenges, AI server memory grows rapidly, supporting market prices ahead.
Table of Contents
- Market Update
- TrendForce's View
- Samsung's DRAM Operating Profit Margins
<Total Pages: 3>
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