Latest US Rules Targeting Direct Export of HBM Will Hinder Development of ASICs in China
Last Modified
2024-12-03
Update Frequency
Aperiodically
Format
On December 2, the U.S. Department of Commerce’s Bureau of Industry and Security (BIS) announced a new set of export control measures targeting China’s semiconductor industry. The key actions include...
Category: AI/HBM/Server
Spotlight Report
-
AI Reshapes Memory: Market Revenue to Peak by 2027
2026/01/20
Semiconductors
PDF
-
Micron to Acquire PSMC’s Tongluo P5 Fab to Contribute to DRAM Supply for 2027
2026/01/18
Semiconductors
PDF
-
DRAM Monthly Datasheet Mar. 2026
2026/03/17
Semiconductors
EXCEL
-
NAND Flash Monthly Datasheet Mar. 2026
2026/03/17
Semiconductors
PDF
-
HBM Industry Analysis - 1Q26
2026/02/04
Semiconductors
PDF
-
DRAM Contract Price Feb. 2026
2026/02/26
Semiconductors
PDF
AI Server PackageRelated Reports
Download Report
25,000
Membership
Spotlight Report
-
AI Reshapes Memory: Market Revenue to Peak by 2027
2026/01/20
Semiconductors
PDF
-
Micron to Acquire PSMC’s Tongluo P5 Fab to Contribute to DRAM Supply for 2027
2026/01/18
Semiconductors
PDF
-
DRAM Monthly Datasheet Mar. 2026
2026/03/17
Semiconductors
EXCEL
-
NAND Flash Monthly Datasheet Mar. 2026
2026/03/17
Semiconductors
PDF
-
HBM Industry Analysis - 1Q26
2026/02/04
Semiconductors
PDF
-
DRAM Contract Price Feb. 2026
2026/02/26
Semiconductors
PDF