TrendForce Offers you a complete analysis on NAND Flash industry wafer input, production output, technology node…etc. by each company.

Key Highlights

• Market Dynamics & Demand Shift: Memory price surges are softening PC and smartphone demand, whereas server market momentum remains strong, boosting overall industry bit output growth. High-layer counts and advanced architecture designs are gaining larger market shares.
• Supplier Strategies & Capacity Plans:
  • Samsung: Constrained by facility space, Samsung is prioritizing process upgrades and allocating more cleanroom resources toward DRAM while maintaining steady NAND bit output growth.
  • SK hynix Group: SK hynix's core facilities face spatial limits leading to slight wafer adjustments, while Solidigm expands fab capacity and ramps up high-layer enterprise SSD production.
  • Kioxia / SanDisk Group: The group is introducing new equipment at key fabs to elevate high-layer production output without aggressive footprint expansions.
  • Micron: Facing facility constraints due to packaging and DRAM reallocations, Micron relies on accelerated process technology transitions to drive output gains.
  • YMTC: Driven by domestic equipment advances, YMTC is accelerating capacity expansions and leading the industry in bit output growth.

Table of Contents

• Index
• Worldwide Annual NAND Flash Capacity Forecasts
• Global NAND Flash Production Breakdown by Makers
• NAND Flash Makers' Production Breakdown by Node Technology
• Samsung's Production Breakdown by Node Technology
• Kioxia/SanDisk's Production Breakdown by Node Technology
• SK hynix's Production Breakdown by Node Technology
• Solidigm's Production Breakdown by Node Technology
• Micron's Production Breakdown by Node Technology
• YMTC's Production Breakdown by Node Technology
• PSMC's Production Breakdown by Node Technology
• Winbond's Production Breakdown by Node Technology
• MXIC's Production Breakdown by Node Technology
• SMIC's Production Breakdown by Node Technology
• NAND Flash Makers' Production Breakdown by Architecture Type
• Samsung's Production Breakdown by Architecture Type
• Kioxia/SanDisk's Production Breakdown by Architecture Type
• SK hynix's Production Breakdown by Architecture Type
• Solidigm's Production Breakdown by Architecture Type
• Micron's Production Breakdown by Architecture Type
• YMTC's Production Breakdown by Architecture Type
• PSMC's Production Breakdown by Architecture Type
• Winbond's Production Breakdown by Architecture Type
• MXIC's Production Breakdown by Architecture Type
• SMIC's Production Breakdown by Architecture Type
• Major NAND Flash Makers's Capacity Breakdown by Fab
• Forecast of NAND Flash Makers' Output Breakdown by Type & Density
• Forecast of Samsung's Capacity/ Output Breakdown by Fab
• Forecast of Kioxia/SanDisk's Capacity/ Output Breakdown by Fab
• Forecast of SK hynix's Capacity/ Output Breakdown by Fab
• Forecast of Solidigm's Capacity/ Output Breakdown by Fab
• Forecast of Micron's Capacity/ Output Breakdown by Fab
• Forecast of YMTC's Capacity/ Output Breakdown by Fab
• Forecast of NAND Flash Makers' Output Breakdown by Type & Density
• Forecast of Samsung's NAND Flash Output Breakdown by Type & Density
• Forecast of Kioxia/SanDisk's Output Breakdown by Type & Density
• Forecast of SK hynix's Output Breakdown by Type & Density
• Forecast of Solidigm's Output Breakdown by Type & Density
• Forecast of Micron's Output Breakdown by Type & Density
• Forecast of YMTC's Output Breakdown by Type & Density

<Total Pages: 40>