TrendForce Offers you a complete analysis on NAND Flash industry wafer input, production output, technology node…etc. by each company.

Key Highlights

• AI and enterprise server demand boost NAND Flash; high-capacity, fast products become mainstream; major vendors ramp 2XX/3XX layers.
• Samsung upgrades to 236/286 layers, modest Korean fab expansion.
• SK hynix focuses on 321 layers, capacity slightly adjusted.
• Solidigm centers on 192 layers, with stable but slightly lower capacity.
• Kioxia/SanDisk moves to BiCS 9 (264 layers); Kioxia steady, SanDisk limited by funding.
• Micron keeps stable output, growth driven by enterprise SSD, continues node upgrades.
• YMTC expands rapidly, targeting 160/260 layers; Fab 3 brings strong growth.
• 2025-2026 sees solid bit growth, rapid 2XX/3XX share rise, 1XX share decline, growing QLC needs.

Table of Contents

• Index
• Worldwide Annual NAND Flash Capacity Forecasts
• Global NAND Flash Production Breakdown by Makers
• NAND Flash Makers' Production Breakdown by Node Technology
• Samsung's Production Breakdown by Node Technology
• Kioxia/SanDisk's Production Breakdown by Node Technology
• SK hynix's Production Breakdown by Node Technology
• Solidigm's Production Breakdown by Node Technology
• Micron's Production Breakdown by Node Technology
• YMTC's Production Breakdown by Node Technology
• PSMC's Production Breakdown by Node Technology
• Winbond's Production Breakdown by Node Technology
• MXIC's Production Breakdown by Node Technology
• SMIC's Production Breakdown by Node Technology
• NAND Flash Makers' Production Breakdown by Architecture Type
• Samsung's Production Breakdown by Architecture Type
• Kioxia/SanDisk's Production Breakdown by Architecture Type
• SK hynix's Production Breakdown by Architecture Type
• Solidigm's Production Breakdown by Architecture Type
• Micron's Production Breakdown by Architecture Type
• YMTC's Production Breakdown by Architecture Type
• PSMC's Production Breakdown by Architecture Type
• Winbond's Production Breakdown by Architecture Type
• MXIC's Production Breakdown by Architecture Type
• SMIC's Production Breakdown by Architecture Type
• Major NAND Flash Makers's Capacity Breakdown by Fab
• Forecast of NAND Flash Makers' Output Breakdown by Type & Density
• Forecast of Samsung's Capacity/ Output Breakdown by Fab
• Forecast of Kioxia/SanDisk's Capacity/ Output Breakdown by Fab
• Forecast of SK hynix's Capacity/ Output Breakdown by Fab
• Forecast of Solidigm's Capacity/ Output Breakdown by Fab
• Forecast of Micron's Capacity/ Output Breakdown by Fab
• Forecast of YMTC's Capacity/ Output Breakdown by Fab
• Forecast of NAND Flash Makers' Output Breakdown by Type & Density
• Forecast of Samsung's NAND Flash Output Breakdown by Type & Density
• Forecast of Kioxia/SanDisk's Output Breakdown by Type & Density
• Forecast of SK hynix's Output Breakdown by Type & Density
• Forecast of Solidigm's Output Breakdown by Type & Density
• Forecast of Micron's Output Breakdown by Type & Density
• Forecast of YMTC's Output Breakdown by Type & Density

<Total Pages: 40>