TrendForce Offers you a complete analysis on NAND Flash industry wafer input, production output, technology node…etc. by each company.

Key Highlights

• Market Overview: AI infrastructure is fueling storage demand, leading to severe shortages in enterprise SSDs due to inadequate HDD supply. NAND Flash manufacturers remain cautious on expansion, primarily optimizing existing capacity.
• Supplier Strategies: Samsung is accelerating the phase-out of older 2D NAND Flash lines to reallocate space for DRAM production, while expanding V7 QLC output and focusing on V8 and higher processes.
• QLC Trend: The market is witnessing a rapid surge in demand for large-capacity QLC, prompting all major suppliers to prioritize the supply and output of high-layer QLC products.
• Capacity & Technology: SK Group faces limited capacity expansion due to fab space constraints and US restrictions. Kioxia/SanDisk and Micron are actively boosting high-layer QLC output. YMTC shows significant capacity and bit growth, driven by technological advancements and new fab additions.
• Bit Growth Forecast: Despite challenges, with manufacturers expanding QLC output, the overall NAND Flash bit output growth rate for next year is projected to exceed twenty percent.

Table of Contents

• Index
• Worldwide Annual NAND Flash Capacity Forecasts
• Global NAND Flash Production Breakdown by Makers
• NAND Flash Makers' Production Breakdown by Node Technology
• Samsung's Production Breakdown by Node Technology
• Kioxia/SanDisk's Production Breakdown by Node Technology
• SK hynix's Production Breakdown by Node Technology
• Solidigm's Production Breakdown by Node Technology
• Micron's Production Breakdown by Node Technology
• YMTC's Production Breakdown by Node Technology
• PSMC's Production Breakdown by Node Technology
• Winbond's Production Breakdown by Node Technology
• MXIC's Production Breakdown by Node Technology
• SMIC's Production Breakdown by Node Technology
• NAND Flash Makers' Production Breakdown by Architecture Type
• Samsung's Production Breakdown by Architecture Type
• Kioxia/SanDisk's Production Breakdown by Architecture Type
• SK hynix's Production Breakdown by Architecture Type
• Solidigm's Production Breakdown by Architecture Type
• Micron's Production Breakdown by Architecture Type
• YMTC's Production Breakdown by Architecture Type
• PSMC's Production Breakdown by Architecture Type
• Winbond's Production Breakdown by Architecture Type
• MXIC's Production Breakdown by Architecture Type
• SMIC's Production Breakdown by Architecture Type
• Major NAND Flash Makers's Capacity Breakdown by Fab
• Forecast of NAND Flash Makers' Output Breakdown by Type & Density
• Forecast of Samsung's Capacity/ Output Breakdown by Fab
• Forecast of Kioxia/SanDisk's Capacity/ Output Breakdown by Fab
• Forecast of SK hynix's Capacity/ Output Breakdown by Fab
• Forecast of Solidigm's Capacity/ Output Breakdown by Fab
• Forecast of Micron's Capacity/ Output Breakdown by Fab
• Forecast of YMTC's Capacity/ Output Breakdown by Fab
• Forecast of NAND Flash Makers' Output Breakdown by Type & Density
• Forecast of Samsung's NAND Flash Output Breakdown by Type & Density
• Forecast of Kioxia/SanDisk's Output Breakdown by Type & Density
• Forecast of SK hynix's Output Breakdown by Type & Density
• Forecast of Solidigm's Output Breakdown by Type & Density
• Forecast of Micron's Output Breakdown by Type & Density
• Forecast of YMTC's Output Breakdown by Type & Density

<Total Pages: 40>