As competition in the foldable smartphone market intensifies, new details about Xiaomi’s next foldable device have begun to surface, with its chip strategy drawing close industry attention. According to Mydrivers, sources say a Xiaomi foldable smartphone with the model number 2608BPX34C has appear...

With its first in-house 3nm chip, XRING O1, grabbing world’s attention in May, Xiaomi seems ready to impress the market again. According to Wccftech, Xiaomi may have already started developing the XRING O2, with its trademark recently filed. According to leakers cited by Wccftech, the XRING O2 ...