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2025-08-13
[News] Samsung Reportedly Pushes SoP Packaging on Ultra-Large Panel, Challenging TSMC and Intel
According to ZDNet, Samsung Electronics is developing System-on-Panel (SoP), an advanced semiconductor packaging technology. The report notes that if SoP advances quickly, Samsung could secure a role in Tesla’s next-generation Dojo packaging supply chain. At present, Tesla plans to have its “AI6...
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