As AI chips continue to scale in size and complexity, demand is rising for next-generation packaging and substrate solutions, with glass substrates emerging as a focal point. According to Sisa Journal, the technology is expected to begin early commercialization in 2027, move through a ramp-up phase ...

As advanced packaging becomes increasingly important, glass substrates are drawing growing industry attention. According to Business Post, SKC and its subsidiary Absolics are expected to begin what could become the world’s first commercial production of glass substrates by the end of this year. ...

As traditional materials approach their physical limits, glass substrates are coming to the forefront of next-generation chip packaging. According to Global Economic, SKC recently announced plans to allocate more than ₩600 billion—over half of its ₩1 trillion capital increase—to its glass su...