According to a report from the Economic Daily News, amid the escalating US-China tech war, Chinese President Xi Jinping emphasized the need to enhance the sense of urgency and intensify efforts in technological innovation. Particularly in six key areas, including semiconductors, industrial machinery...

According to a report from Nikkei citing sources, TSMC is developing a new advanced chip packaging technology that uses rectangular panel-like substrates, rather than the traditional circular wafers currently in use. This technology allows for more chips to be placed on a single substrate, addres...

According to a report from Reuters on June 19, to further restrict China's semiconductor industry and prevent the use of semiconductor manufacturing equipment in military applications, Alan Estevez, the U.S. Commerce Department's Under Secretary for Industry and Security, will visit the Netherlands...

Recently, Reuters reported that NATO (North Atlantic Treaty Organization) has confirmed the first companies to receive Innovation Fund of EUR 1 billion (USD 1.1 billion). The companies are four European tech startups namely London-based AI chip manufacturer Fractile and Germany-based robotics compan...

The US government’s CHIPS and Science Act is reportedly injecting funds into chip manufacturing at an unprecedented rate. According to a recent report by the U.S. Census Bureau, the growth rate of construction funding for computer and electrical manufacturing is remarkably high. The amount of mon...