As HBM competition heats up, the world’s top three memory giants—SK hynix, Samsung, and Micron—will share the stage in Taiwan for the first time this September at the Memory Executive Summit during SEMICON Taiwan 2025, according to Commercial Times and Knews. As per SEMICON Taiwan, the su...

At the SEMICON Taiwan 2024, Samsung's Head of Memory Business, Jung Bae Lee, stated that as the industry enters the HBM4 era, collaboration between memory makers, foundries, and customers is becoming increasingly crucial. Reportedly, Samsung is prepared with turnkey solutions while maintaining fl...

With advanced packaging capacity at TSMC being tight, the expansion of CoWoS has garnered significant attention. According to a report from Economic Daily News, Jun He, Vice President of Advanced Packaging Technology and Service at TSMC, noted at SEMICON Taiwan 2024 that the foundry giant is rapidl...