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    2026-03-16

    [News] China Completed the World’s First 35-micron Ultra-Thin Wafer Process and Packaging & Testing Production Line

    Semiconductors

    According to official sources from Shanghai’s Songjiang District, Nixi Semiconductor Technology (Shanghai) Co., Ltd., located in the Songjiang Comprehensive Bonded Zone, has officially completed the world’s first 35-micron ultra-thin wafer process and packaging & testing production line for ...

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