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    • Panel Level Packaging

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    2025-09-19

    [News] STMicroelectronics Joins Panel-Level Packaging Race with New French Pilot Line, Launching 3Q 2026

    Semiconductors

    As leading foundries and packaging giants such as TSMC and ASE ramp up panel-level packaging (PLP) capacity, STMicroelectronics has emerged as an unexpected contender. The company announced it will establish a new pilot line at its Tours site in France to advance next-generation PLP technology, with...

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