As the demand for AI GPUs increases, TSMC's advanced packaging capacity for CoWoS is struggling to keep up. Recently, according to a report from Commercial Times, NVIDIA has reportedly turned to Intel for advanced packaging solutions. According to industry sources cited by the same report, TS...

Amid the heating tech war between the U.S. and China, and the stringent sanctions imposed to prevent China from obtaining cutting-edge chips, it appears that China is still able to find its way out. According to a report by Tom’s Hardware, citing the New York Times, the latest tactic of China woul...

According to a report from Bloomberg, Jun Young-hyun, head of Samsung's chip business, recently sent a stern warning to employees about the need to reform the company's culture to avoid falling into a vicious cycle. Jun stated that the recent improvement in Samsung's performance was due to a re...

According to a report from Commercial Times, IC design giant MediaTek is making its move into the AI accelerator sector. MediaTek CEO Rick Tsai emphasized that MediaTek aims to be the best partner for edge AI, focusing on advanced technologies and 3nm process to optimize the power consumption and e...

NVIDIA's next-generation Blackwell architecture AI superchip is about to ship. According to a report from Commercial Times, on July 29 during the SIGGRAPH conference in Denver, USA, NVIDIA announced a series of software updates and revealed that samples of the new AI chip architecture Blackwell have...