Previously, speculation circulated that NVIDIA might reduce its CoWoS orders from TSMC. However, according to Economic Daily News, TSMC’s advanced packaging orders have experienced an upsurge. Sources indicate that NVIDIA’s latest Blackwell architecture GPU chips are in strong demand, and the...

U.S. chip giant NVIDIA has reportedly updated its policy with memory suppliers, now requiring HBM stacks to be fully tested before being shipped to foundries for packaging, according to South Korean media outlet TheElec. The report indicates that HBM stacks from memory makers were previously sent...

Amid concerns that whether Singapore has become a major intermediary of transferring NVIDIA chips to China, Tan See Leng, Second Minister for Trade and Industry, stated that less than 1% of NVIDIA’s total revenue comes from products physically delivered to the country, according to Bloomberg and l...

According to a report from ijiwei, citing Business Korea, Micron Technology is set to begin mass production of its 12-stack HBM and will supply it to AI semiconductor giant NVIDIA. As highlighted by the report, Micron completed the development of its 12-stack HBM in September 2024 and has since s...

As NVIDIA collaborates closely with memory heavyweights on their latest HBM products for AI accelerators, the U.S. chip giant is said to be in talks with Samsung and SK hynix to push the commercialization of a next-gen memory technology called SOCAMM (System on Chip Advanced Memory Module), accordi...