As agentic AI fuels a structural upswing in CPU demand, the memory architecture behind those processors is moving into equally sharp focus. As MRDIMM (Multiplexed Rank Dual In-line Memory Module) is emerging as one of the key solutions to that bottleneck, the Joint Electron Device Engineering Counci...

Amid surging AI and edge computing demand, memory standards continue to evolve at pace. In a recent release, JEDEC Solid State Technology Association revealed new features under consideration for the next revision of its JESD209-6 LPDDR6 standard, while also confirming that an LPDDR6-based SOCAMM2 (...