Subject


Innoscience


2025-12-05

[News] Innoscience Scores Major Patent Win Against Infineon as ITC Rules No Infringement

Innoscience announced that the U.S. International Trade Commission ruled in favor of the company and against Infineon Technologies in a section 337 (patent infringement) investigation that was brought by Infineon against the Chinese GaN giant. The court ruled that Infineon’s U.S. Patent No. 9,070...

2025-12-04

[News] onsemi Partners With China’s Innoscience on Low/Mid-Voltage GaN, Sampling Expected in 1H26

onsemi and Innoscience signed a memorandum of understanding (MoU) on December 2 to speed up the deployment of GaN power devices, starting with 40–200V offerings. onsemi expects sampling to begin in the first half of 2026, as noted in its press release. The partnership aims to combine onsemi’s ex...

2025-08-04

[News] NVIDIA Picks Innoscience as Sole Chinese Supplier for 800 VDC Power—Unpacking the GaN Giant

When NVIDIA released its supplier list last week for the 800 VDC power architecture powering AI data centers, GaN power chipmaker Innoscience stood out as the only Chinese supplier, capturing widespread public attention, as per the Economic Daily News and The Business Times. Innoscience confirmed...

2025-07-11

[News] Is the GaN Foundry Model Facing Trouble? China’s Innoscience Weighs In as TSMC Plans 2027 Exit

While TSMC plans to exit the gallium nitride (GaN) wafer foundry business by 2027, industry heavyweight Infineon is ramping up its efforts—signaling a notable shift within the GaN sector. What factors might be driving these diverging strategies? According to a report from STAR Market Daily, Board ...

2025-01-09

[News] China’s Third-Generation Semiconductor Companies Rush Overseas

Following the acceptance of the IPO application by Tianyu Semiconductor on the main board of the Hong Kong Stock Exchange (HKEX) on December 23, 2024, two other Chinese third-generation semiconductor companies, Innoscience and SICC, have also made moves towards listing on the Hong Kong market. Among...

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