As CoWoS capacity tightens amid soaring AI-driven demand, semiconductor giants are turning to fan-out panel-level packaging (FOPLP), as square substrates allow for significantly more chips per panel. According to the Economic Daily News, Taiwanese panel maker Innolux aims to begin FOPLP mass product...

On January 7, 2025, the International Consumer Electronics Show (CES 2025) officially opened in Las Vegas, USA. As a globally renowned tech event, CES attracted numerous companies around the world. In the field of panels and displays, many new products and advanced technologies were unveiled. BOE ...

According to a report by the Commercial Times, Jin-Yang Hung, Chairman of panel manufacturing giant Innolux, expressed cautious optimism for the company’s outlook in 2024. He noted that demand and pricing for TV panels are likely to recover, while PC panels are expected to see modest growth. Howev...

The AI boom has boosted the semiconductor industry, increasing the demand for advanced packaging production capacity. According to a report in Economic Daily News, TSMC is rumored to be considering the acquisition of another Innolux plant, particularly its 7th plant in the Southern Taiwan Science Pa...

In mid-August, TSMC had signed a contract with panel manufacturer Innolux to purchase its plant and facilities located in southern Taiwan, eyeing to further expand its advanced packaging capacity. According to a report by China Times, the fab, designated as the AP8 facility, is expected to start pro...