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    • hybrid bonder

    News

    2025-10-07

    [News] Hybrid Bonder Market Could Hit $2B by 2028 as Korean Makers Push Next-Gen HBM Tools

    Semiconductors

    As HBM suppliers weigh the shift to hybrid bonding for their 16-layer HBM4 products to address TSV yield bottlenecks, News1 Korea, citing industry analysts, reports that the hybrid bonding market is set to soar in the HBM4E era, with its share projected to hit around 50% by 2028. News1 Korea note...

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