According to FETV, Samsung has reportedly passed Broadcom’s qualification test for its HBM3E 8-Hi prototype, raising the prospect of rejoining the supply chain. Multiple testing equipment sources cited in the report indicate that its improved 8-Hi product has successfully passed the verification, ...

AMD officially unveiled its MI350 series GPUs at the Advancing AI 2025 event on June 12—and its key suppliers are now coming into focus. According to Commercial Times, both the MI350X and MI355X are built on TSMC’s N3P node. On the memory front, Sedaily reports that the chips pack 12-high HBM3E ...

As Micron—the key rival in the race to win NVIDIA’s HBM orders—announced it has shipped its first 12-layer HBM4 samples, Samsung reportedly stumbled in its third attempt to pass NVIDIA’s HBM3E 12-layer validation in June. According to Business Post citing securities analysts, the company now...

Samsung has been working hard to pass NVIDIA’s qualification test for its 12-layer HBM3E. However, even if successful, the company is unlikely to see significant short-term revenue, according to a report from Deal Site. While Samsung may complete the qualification later this year, the report notes...

While Samsung races full steam ahead with its 12hi HBM3e validation and HBM4 development, Micron stays under the radar. But according to New Daily, the U.S. memory giant is quietly gaining ground—its 12hi HBM3e yields are rapidly improving, earning rave reviews from major CSPs. Citing Micron’...