Subject


HBM


2024-07-05

[News] Samsung Establishes New HBM Team to Advance HBM3, HBM3e and HBM4 Development

In order to address the growing demand for high-performance memory solutions fueled by the expansion of the artificial intelligence (AI) market, Samsung Electronics has formed a new "HBM Development Team" within its Device Solutions (DS) Division to enhance its competitive edge in high-bandwidth mem...

2024-07-04

[News] Samsung’s HBM3e Reportedly Passed NVIDIA’s Certification Though It Denies the Rumor

In early June, NVIDIA CEO Jensen Huang revealed that Samsung’s High Bandwidth Memory (HBM) is still striving on the certification process, but is one step away from beginning supply. On July 4th, a report from Korea media outlet Newdaily indicated that Samsung has finally obtained approval from th...

2024-07-03

[News] HBM and Advanced Packaging Expected to Benefit Silicon Wafer

As artificial intelligence (AI) technology enjoys rapid advances, the demand for AI chips is skyrocketing, driving continuous improvements in advanced packaging and HBM (High Bandwidth Memory) technology, which is expected to benefit the silicon wafer industry. Recently, Doris Hsu, the Chairperso...

2024-07-02

[News] Huawei and XMC Collaborate to Develop HBM, Looking to Break Through U.S. Sanctions

According to a report from the Korean media outlet The Chosun Daily, Chinese company Huawei plans to collaborate with memory manufacturer Wuhan Xinxin Semiconductor Manufacturing Co. (XMC) to produce High Bandwidth Memory (HBM) semiconductors. Additionally, Jiangsu Changjiang Electronics Technology...

2024-07-01

[News] Micron Targets 2026-2029 for its U.S. Fabs to Commence Operation

After Micron’s announcement of constructing two new fabs in the U.S. in 2022, the memory giant has now provided more details regarding their production timeline. According to the information the company disclosed in its Q3 FY24 financial report and its conference call, the fabs in Idaho and New Yo...

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