Subject


Hanmi Semiconductor


2025-04-28

[News] The TC Bonder Dispute: Is Hybrid Bonding for 16Hi HBM the Spark Behind the Hanmi-SK hynix Rift?

Amid growing tensions with its longtime TC bonder supplier Hanmi Semiconductor, SK hynix is reportedly taking things a step further. According to Financial News, the HBM leader has started reviewing a full diversification of all Hanmi-supplied equipment—not just TC bonders. While rumors suggest...

2025-04-24

[News] Hanmi Semiconductor Reportedly Sees Strong TC Bonder Demand from Micron, Chinese Clients

As the HBM race heats up, TC (thermal compression) bonders, which stack chips onto processed wafers by employing thermal compression to bond, are in hot demand. Memory giants are scrambling to lock in orders, and according to Money Today, Hanmi Semiconductor is seeing a surge in overseas interest, e...

2025-04-23

[News] The TC Bonder Drama: Could Hanmi’s Supply Shift the HBM Race Between Micron, SK hynix, and Samsung?

As the HBM race heats up among memory giants, TC (thermal compression) bonders are taking center stage. Notably, recent developments involving key player Hanmi Semiconductor, Micron, and SK hynix have sparked attention—and could potentially reshape the memory landscape, according to reports from T...

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