As China races toward semiconductor self-reliance, the rollout of next-generation chips is not only boosting local equipment and materials makers, but creating opportunities for South Korean firms like Hanmi Semiconductor and SEMES, New Daily reports. Memory Boom Fuels Korean Equipment Exports to...

As HBM suppliers weigh the shift to hybrid bonding for their 16-layer HBM4 products to address TSV yield bottlenecks, News1 Korea, citing industry analysts, reports that the hybrid bonding market is set to soar in the HBM4E era, with its share projected to hit around 50% by 2028. News1 Korea note...

According to a report from ZDNet on July 15, Hanmi Semiconductor Chairman Kwak Dong-shin dismisses speculation that the company will adopt a hybrid bonder system for now, stating that Hanmi’s TC bonders are sufficient for HBM4 and HBM5, following JEDEC’s April decision to relax AI packaging thic...

Hanmi Semiconductor Forms HBM4 Equipment R&D Team Recently, Hanmi Semiconductor officially announced the establishment of a dedicated team focused on the development of HBM4-related equipment. On May 14, the company launched the “TC Bonder 4,” specifically designed for HBM4 production....

As China races to localize AI chips and memory, rumors are mounting that Washington may tighten controls on its HBM production. According to Chinese media outlet EE Times China, Hanmi Semiconductor has informed Chinese clients it will halt shipments of TC bonders, crucial tools for stacking HBM chip...