As CoWoS capacity tightens amid soaring AI-driven demand, semiconductor giants are turning to fan-out panel-level packaging (FOPLP), as square substrates allow for significantly more chips per panel. According to the Economic Daily News, Taiwanese panel maker Innolux aims to begin FOPLP mass product...

Amid the booming demand for advanced packaging used in AI chips, TSMC Chairman C.C. Wei confirmed in the July earnings call that the company has been working on a mini production line for FOPLP (Fan-Out Panel Level Packaging), with achievements expected within three years. Now here’s the latest...

TSMC and Samsung are not just archrivals in the foundry market. They also confront each other in an emerging sector, the Fan-Out Panel-Level Packaging (FOPLP) technology. According to South Korean media outlet ETnews, the two semiconductor giants, while both eyeing FOPLP as a secret weapon to high-p...

According to a report by the Commercial Times, Jin-Yang Hung, Chairman of panel manufacturing giant Innolux, expressed cautious optimism for the company’s outlook in 2024. He noted that demand and pricing for TV panels are likely to recover, while PC panels are expected to see modest growth. Howev...

The surging global demand for AI chips is straining advanced packaging capacity, driving a sharp focus on fan-out panel-level packaging (FOPLP) within Taiwan's semiconductor industry. According to a report by Commercial Times, major packaging and testing firms such as ASE and Powertech, alongside eq...