Subject


Empyrean Technology


2025-08-19

[News] Empyrean Reportedly Unveils China’s First Full-Process EDA Platform for Memory Chip Production

According to ijiwei, Chinese EDA giant Empyrean Technology has reportedly launched the country’s first full-process EDA solution for memory chips that supports mass production of Flash and DRAM, enabling one-stop design–verification–manufacturing. The report adds that the solution is expected ...

2025-06-05

[Insights] China’s EDA Self-Sufficiency Tops 10% in 2024 — Will U.S. Crackdown Boost or Block Its Chip Push?

After Huawei’s Kirin X90 reportedly entered mass production on 5nm and Xiaomi wowed the world with its self-developed XRING O1—rumored to be built on 3nm—all eyes are now on China’s chip scene. However, with Washington blocking EDA giants like Synopsys, Cadence, and Siemens from supportin...

2025-02-17

[News] SK hynix Reportedly Weighs Suspension of Chinese EDA Software Amid Expected U.S. Restrictions

According to a report from Korean Economic Daily, citing industry sources, SK hynix has initiated an urgent review of Chinese semiconductor Electronic Design Automation (EDA) software anticipating that the U.S. may impose restrictions on South Korean semiconductor firms using Chinese software. On...

2024-12-11

[News] China’s EDA Giant Empyrean Technology Shifts Control to State-Owned Company after U.S. Blacklist

A week after Empyrean Technology has been added to the blacklist in the latest wave of U.S. chip export controls, the Chinese developer of chip design system has ceded control to its largest state-owned shareholder, China Electronics Corporation (CEC). According to a report from South China Morning ...

2023-12-04

[News] Latest Updates on Five Semiconductor Companies Projects in China

Advancements continue in China's semiconductor landscape with progress reported in five major semiconductor projects. Companies like BYD Semiconductor, Empyrean Technology, CGEE, Sinopack, and CETC (Shanxi) have witnessed recent developments across semiconductor materials, design, packaging and test...

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