As demand for high-speed transmission in AI data centers surges, TSMC is further advancing its co-packaged optics (CPO) roadmap. According to Commercial Times, TSMC recently disclosed that its “COUPE on Substrate” solution is expected to enter mass production in the second half of 2026. By exten...

Foxconn, a key server supplier to NVIDIA and major assembler for Apple, reported a strong first quarter, posting net profit of NT$49.919 billion and record sales of NT$2.12 trillion, with EPS rising 17% year on year to NT$3.56 and gross margin improving to 6.18%, according to its press release. C...

The AI chip race is intensifying across the board, with advanced packaging growing in significance and driving a surge in OSAT capital spending. According to Commercial Times, Taiwan-based OSAT players ASE, Powertech, and King Yuan Electronics (KYEC) are expected to see their combined capital expend...

Samsung Foundry is reportedly stepping up its silicon photonics efforts. According to ZDNet, the company said in its 1Q26 earnings release that its foundry has secured orders from a major optical communication module provider. Samsung Electronics said it is currently in talks with several major g...

On April 28, Lightelligence—often described as the world’s first publicly listed AI silicon photonics chip listed company—debuted on the Hong Kong Stock Exchange. The company issued 13,795,215 shares at HKD 183.2 each, raising HKD 2.53 billion. Net proceeds came to HKD 2.38 billion after li...