Following its North America Technology Symposium, TSMC has shared fresh details on its CoWoS (Chip on Wafer on Substrate with silicon interposer) roadmap. According to Tom’s Hardware, Kevin Zhang, TSMC’s Senior Vice President and deputy COO, confirmed how companies like Cerebras and Tesla (with ...

At TSMC’s North America Technology Symposium, the foundry giant rolled out an ambitious roadmap for its CoWoS technology. Meanwhile, major customer NVIDIA is showing signs of strong momentum too. According to Commercial Times, NVIDIA’s production schedule for its B300 series has reportedly been ...

Previously, speculation circulated that NVIDIA might reduce its CoWoS orders from TSMC. However, according to Economic Daily News, TSMC’s advanced packaging orders have experienced an upsurge. Sources indicate that NVIDIA’s latest Blackwell architecture GPU chips are in strong demand, and the...

According to a report from Economic Daily News, TSMC plans to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP), with an estimated investment exceeding NTD 200 billion. Construction at the STSP Phase III site is expected to begin as early as March 2025, a...

Ahead of TSMC’s earnings call on January 16th, market rumors have been circulating that the foundry giant’s largest clients are slashing their CoWoS-S orders. According to Commercial Times, AMD and Broadcom are reportedly releasing the CoWoS-S capacity they previously booked due to slowing deman...