Subject


Cooling


2025-06-12

[News] HBM5 Expected to Feature Immersion Tech as Cooling Becomes Key to HBM Race

As leading memory makers advance in HBM development, cooling technology is expected to become a key competitive factor once HBM5 enters commercialization—likely around 2029—according to Joungho Kim, a KAIST professor cited by The Elec. As noted in the report, Kim explains that while packaging...

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