Recently, China Electronics System Engineering No. 2 Construction Co., Ltd. (CESE2) announced the successful roll-out of the first batch of products from the 8-inch MEMS wafer production line project at the China Bengbu Sensor Valley. This marks China's first fully automated 8-inch MEMS wafer produc...

From January to October, China’s semiconductor equipment industry has shifted from pursuing “single-point breakthroughs” to achieving “system-level integration.” Major industry alliances have fueled this transformation, with leading companies raising over 13 billion yuan through private pl...

As China pushes to localize chipmaking amid U.S. export controls, developing domestic lithography tools has become a top priority — with ASML’s EUV and DUV systems at the center of its ambitions. Recently, China has reportedly intensified efforts to study the Dutch giant’s DUV machines. Accord...

Beijing is stepping up its anti-dumping probe into U.S. analog chips. Following the Ministry of Commerce’s announcement, authorities have swiftly moved to implement the investigations. According to Bloomberg, China’s Trade Remedy and Investigation Bureau under the Ministry of Commerce has issued...

On October 15, a research team led by Professor Fang Lu from the Department of Electronic Engineering at Tsinghua University announced the successful development of “Yuheng,” the world’s first sub-ångström snapshot spectral imaging chip. The breakthrough has been published online in the pres...