Singapore-headquartered ASMPT, which specializes in semiconductor assembly and packaging solutions, announced on August 11th that it will strategically restructure its manufacturing operations in China by closing Advanced Semiconductor Equipment (Shenzhen) Co., Ltd. in Bao’an District, Shenzhen, w...

According to a ZDNet report citing industry sources on the 25th, leading global semiconductor back-end equipment manufacturers are expected to expand their HBM hybrid bonding operations in the second half of 2025. BESI Expects Rising Hybrid Bonding Orders in H2 2025 On July 24, Dutch equipment...