As SK hynix pushes ahead with HBM4 production, attention is turning to TC bonder suppliers. According to The Elec, citing sources, SK hynix has placed a new order for thermal compression (TC) bonders with Singapore-based ASMPT to support HBM4 manufacturing. The order reportedly comes amid an ongoing...

Singapore-headquartered ASMPT, which specializes in semiconductor assembly and packaging solutions, announced on August 11th that it will strategically restructure its manufacturing operations in China by closing Advanced Semiconductor Equipment (Shenzhen) Co., Ltd. in Bao’an District, Shenzhen, w...

According to a ZDNet report citing industry sources on the 25th, leading global semiconductor back-end equipment manufacturers are expected to expand their HBM hybrid bonding operations in the second half of 2025. BESI Expects Rising Hybrid Bonding Orders in H2 2025 On July 24, Dutch equipment...