According to Nikkei, citing sources, TSMC is removing Chinese chipmaking equipment from its leading-edge 2nm fabs to guard against potential U.S. restrictions that could disrupt production. As the report notes, sources said the decision was influenced by the prospect of a U.S. regulation that would ...

Hanmi Semiconductor Forms HBM4 Equipment R&D Team Recently, Hanmi Semiconductor officially announced the establishment of a dedicated team focused on the development of HBM4-related equipment. On May 14, the company launched the “TC Bonder 4,” specifically designed for HBM4 production....

As U.S. chip export controls tighten, China is fast-tracking its push for semiconductor self-sufficiency. Alongside Naura Technology and Huawei-linked SiCarrier, etching equipment leader AMEC is also rising rapidly. According to local media Science and Technology Innovation Express News, from 2019 t...

Driven by both policy and market demand, a wave of mergers and acquisitions is sweeping through China's semiconductor industry, with equipment manufacturers actively participating. Following NAURA’s announcement of acquiring shares in KINGSEMI, another major development has emerged—HWATSING has ...

According to TechNews, China is accelerating its efforts to localize semiconductor production. Among these efforts, semiconductor equipment serves as the cornerstone of the industry, and its level of localization directly determines the overall autonomy and control of the semiconductor supply chai...