As AI chips continue to scale in size and complexity, demand is rising for next-generation packaging and substrate solutions, with glass substrates emerging as a focal point. According to Sisa Journal, the technology is expected to begin early commercialization in 2027, move through a ramp-up phase ...

Commercialization of glass substrates is accelerating, with South Korean players and Intel increasingly competing head-on for leadership. According to Global Economic, sources indicate that Intel has laid out a glass substrate roadmap targeting 2030 to secure a technological edge, while Korean firms...

As traditional materials approach their physical limits, glass substrates are coming to the forefront of next-generation chip packaging. According to Global Economic, SKC recently announced plans to allocate more than ₩600 billion—over half of its ₩1 trillion capital increase—to its glass su...

The advancement of glass substrate technology has drawn significant attention across the semiconductor industry. According to a report from ETNews, industry sources on July 3 noted that Absolics—a subsidiary of SKC—is ramping up its production of glass substrates. ETNews highlights that this mov...