Subject


3D NAND


2025-02-24

[News] Samsung Rumored to Adopt Hybrid Bonding Patent from China’s YMTC for 400+ Layer NAND

As memory giants fiercely compete to push the limits of NAND technology, a surprising twist has emerged: Samsung is reportedly set to use a hybrid bonding patent from China’s YMTC, starting with its V10 (10th generation) NAND, according to the latest ZDNet report. The report indicates that Sams...

2024-11-28

[News] Samsung Cuts Photoresist Usage in 3D NAND Production, Boosting Cost Efficiency

Samsung has significantly reduced the amount of photoresist (PR) used during the photolithography process in its 3D NAND flash production, according to a report by The Elec. Citing industry sources, The Elec revealed that the Samsung has halved the volume of PR used in the production of its advan...

2024-10-25

[News] Kioxia to Unveil new DRAM, SCM, and NAND Technologies in December

Kioxia is set to introduce its progress on DRAM storage-class memory (SCM) and 3D-NAND technologies at the IEEE International Electron Devices Meeting (IEDM) 2024 conference in San Francisco in December, featuring its Oxide-Semiconductor Channel Transistor DRAM (OCTRAM) technology jointly developed...

2024-07-22

[News] China-US Chip War Escalated as YMTC Sues Micron for Patent Infringement

According to a previous report from Bloomberg, Chinese 3D NAND Flash giant YMTC recently filed a lawsuit against American memory giant Micron in California, accusing Micron of infringing on 11 of its patents related to 3D NAND Flash and DRAM products. YMTC is requesting the court to order Micron to ...

2024-06-27

[News] Outpacing Samsung or the End of Race? Kioxia Aims 1000-layer NAND by 2027

After ending production cuts amidst a recovery in the memory industry, Kioxia disclosed its plans on the 3D NAND roadmap last week. According to reports from PC Watch and Blocks & Files, Kioxia stated that achieving a 1,000-layer level by 2027 would be possible. According to the reports, the ...

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