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2.5D Packaging
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2023-06-06
Disruption in 2.5D/3D Packaging: Hybrid Bonding Rising as New Cornerstone
The surge in AIGC and new technologies such IoT, AI, 5G, AR/VR are driving a huge demand for computational power of high-end chips. This has been even outpacing the performance increase offered by the long-standing Moore's Law, ushering in a "post-Moore" era where revolutions in advanced chip design...
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