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Articles


2023-09-08

Continuing Moore’s Law: Advanced Packaging Enters the 3D Stacked CPU/GPU Era

As applications like AIGC, 8K, AR/MR, and others continue to develop, 3D IC stacking and heterogeneous integration of chiplet have become the primary solutions to meet future high-performance computing demands and extend Moore's Law. Major companies like TSMC and Intel have been expanding their i...

2023-09-07

[News] Xiaomi Begins Trial Production of 50 Prototype Cars per Week

According to Taiwan media, UDN, an insider close to Xiaomi's automotive venture, Xiaomi's car project is currently in the trial production phase, which has been underway for less than a month. Currently, Xiaomi is producing approximately 50 prototype cars per week. As reported by Interface News,...

2023-09-07

Can China’s Indigenous AI Chips Compete with NVIDIA?

In its FY2Q24 earnings report for 2023, NVIDIA disclosed that the U.S. government had imposed controls on its AI chips destined for the Middle East. However, on August 31, 2023, the U.S. Department of Commerce stated that they had "not prohibited the sale of chips to the Middle East" and declined to...

2023-09-07

[News] CoWoS Production Shortage, TSMC Expects Capacity Will Catch Up in 1.5 Years

According to Taiwan's Economic Daily, TSMC Chairman Mark Liu stated on 9/6 that semiconductor technology development "has reached the exit of the tunnel, and there are more possibilities beyond the tunnel; we are no longer bound by the tunnel." Regarding TSMC's progress in establishing a factory ...

2023-09-07

[News] No Improvement in Demand, TV Panel Faces Price Pressure Starting in October

TrendForce released panel price forecasts for early September, with Eric Chiou, Senior Research Vice President at TrendForce, noting that TV panel prices have been on the rise since February. However, despite the price uptrend, end-demand remains subdued. Coupled with the overall unfavorable economi...

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