Japanese telecommunications operator NTT is reportedly collaborating with American chipmaker Intel and other semiconductor manufacturers to research large-scale production of next-generation semiconductor technology, which involves significantly reducing power consumption using optical technology. ...

With the highly anticipated opening of TSMC's Kumamoto fab on February 24th, 2024, multiple Japanese or global semiconductor manufacturers are set to begin large-scale production in newly established plants in Japan. According to sources cited by TechNews, this development will stimulate the gro...

Since the release of the Huawei Mate 60 series smartphones, the Huawei Kirin chipset has been making a comeback with various iterations, including the Kirin 9000s and Kirin 9000E featured in the Mate 60 series. The latest update has revealed the confirmation of a new Kirin chipset named Kirin 9000W...

Amid the AI trend, the significance of high-value-added DRAM represented by HBM continues to grow. HBM (High Bandwidth Memory) is a type of graphics DDR memory that boasts advantages such as high bandwidth, high capacity, low latency, and low power consumption compared to traditional DRAM chips. ...

NAND flash memory giants Kioxia and Western Digital (WD) were reported to be in negotiations with intentions to merge. However, the merger talks between Kioxia and WD were halted in October last year due to opposition from SK Hynix, the South Korean memory giant indirectly invested in Kioxia. As...