According to a report from Nikkei citing sources, TSMC is developing a new advanced chip packaging technology that uses rectangular panel-like substrates, rather than the traditional circular wafers currently in use. This technology allows for more chips to be placed on a single substrate, addres...

Apple is reportedly shifting its mixed reality (MR) device strategy by abandoning the development of its existing high-end Vision Pro headset in favor of launching an affordable MR device expected to debut next year. According to a report from Economic Daily News, it's rumored that Foxconn is likel...

According to a report from Nikkei citing sources, memory giant Micron Technology is building a pilot production line for advanced high-bandwidth memory (HBM) in the United States and is considering producing HBM in Malaysia for the first time to capture more demand from the AI boom. Reported on J...

While TSMC faces overwhelming demand for its 3nm technology, with orders from major clients like Apple and NVIDIA pouring in, Intel has now announced its progress on the 3nm technology. According to the latest report by Tom’s Hardware, Intel 3 has entered high-volume production at two sites, the O...

According to a report from Reuters on June 19, to further restrict China's semiconductor industry and prevent the use of semiconductor manufacturing equipment in military applications, Alan Estevez, the U.S. Commerce Department's Under Secretary for Industry and Security, will visit the Netherlands...