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2024-07-22

[News] Samsung’s 2nm Node Will Reportedly Feature 30% More EUV Layers

As the industry is entering the Angstrom era with semiconductor giants eagerly applying EUV machines to the advanced nodes, more details about Samsung’s 2nm have surfaced. According to the latest report by TheElec, Samsung’s 2nm process will feature 30% more extreme ultraviolet (EUV) layers than...

2024-07-19

[News] China Reportedly Imposes Mandatory AI Model Reviews on ByteDance, Alibaba, and Others

According to a report from global media outlet Financial Times citing sources, Chinese authorities plan to implement mandatory reviews of large AI models. Reportedly, Chinese government officials are testing the large language models of AI companies to ensure that the systems embody core socialis...

2024-07-19

[News] TSMC Maintains Overseas Expansion Strategy, Unfazed by Geopolitical Disruptions

According to a report from Economic Daily News, amid U.S. presidential candidate Donald Trump's remarks claiming that Taiwan is taking away chip business and should pay the U.S. for defense, geopolitical risks have become another focal point at TSMC's July 18 earnings call. TSMC stated that wheth...

2024-07-19

[News] Samsung and Google Reportedly under EU Scrutiny for AI Integration in New Smartphones

Earlier on July 10th, in the Galaxy Unpack 2024 event in Paris, Samsung introduced its AI smartphone Galaxy Z Fold6 and Galaxy Z Flip6, along with the “Google Gemini” app installed in the models. However, according to the reports by Reuters and Business Korea, these two tech giants may be facing...

2024-07-19

[News] TSMC Pushes for FOPLP Mass Production by 2027, Reportedly Eyeing on Innolux’s Plant

To continue advancing Moore's Law, TSMC Chairman and President C.C. Wei personally confirmed that FOPLP (Fan-Out Panel-Level Packaging) is in full swing. According to a report from Commercial Times, TSMC has established an R&D team and production line, currently still in the initial stages. ...

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