According to a previous report from Bloomberg, Chinese 3D NAND Flash giant YMTC recently filed a lawsuit against American memory giant Micron in California, accusing Micron of infringing on 11 of its patents related to 3D NAND Flash and DRAM products. YMTC is requesting the court to order Micron to ...

As geopolitical tensions rise, a significant increase in orders from China for TSMC was seen last quarter. According to a report from Economic Daily News, as the U.S. presidential election countdown continues, both party candidates agree on expanding semiconductor export controls to China. Conseque...

TSMC continues to showcase its drive in the advanced packaging market. According to a report from MoneyDJ, TSMC has forecasted that CoWoS will remain in high demand through 2025, with potential for capacity to double in two consecutive years. TSMC is also entering the FOPLP (Fan-Out Panel-Level Pac...

According to a report from The Information, generative AI application giant OpenAI has held talks with several chip designers, including Broadcom, to discuss plans for developing new AI chip. It’s reported that OpenAI is currently exploring the possibility of manufacturing its own AI chip. This...

As the industry is entering the Angstrom era with semiconductor giants eagerly applying EUV machines to the advanced nodes, more details about Samsung’s 2nm have surfaced. According to the latest report by TheElec, Samsung’s 2nm process will feature 30% more extreme ultraviolet (EUV) layers than...