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2024-11-29

[News] TSMC Could Begin 2nm Chip Production in the U.S. No Earlier than 2028

The U.S. government’s efforts to boost domestic semiconductor manufacturing continue to gain momentum. According to a report from TechNews, information submitted by TSMC to the U.S. Department of Commerce reveals that the 2nm process is expected to begin production in the U.S. as early as 2028. ...

2024-11-29

[News] 8 Rumored Features of the Apple iPhone 17 Pro

Although the Apple iPhone 17 series is still ten months away from its launch, the market is already buzzing with numerous rumors about the new devices. According to a report from TechNews, citing MacRumors, the iPhone 17 Pro is rumored to feature eight potential changes: Aluminum Frame Accordi...

2024-11-29

[News] Kioxia Reportedly Planning Production Cuts Amid NAND Flash Market Challenges

According to a report by Commercial Times, worsening conditions in the NAND Flash market have sparked speculation within the memory industry that Kioxia may implement production cuts in December 2024, potentially halting the decline in prices or even reversing the trend. Industry insiders quoted ...

2024-11-29

[News] U.S. Reportedly to Unveil Chip Restrictions Next Week, Impacting Samsung, SK hynix, and Micron

Rumors have been circulating that the Biden administration might announce new export restrictions targeting China around Thanksgiving. Now more details have surfaced, as a report from Bloomberg indicates that additional restrictions on the sale of semiconductor equipment and AI memory chips to China...

2024-11-29

[News] TSMC on Track to Qualify Ultra-Large CoWoS with 9x Reticle Sizes, 12 HBM4 Stacks by 2027

According to a report from TechNews, citing Tom’s Hardware, at its European Open Innovation Platform (OIP) Forum, TSMC announced that its ultra-large chip-on-wafer-on-substrate (CoWoS) packaging technology would be certified by 2027, featuring 9x reticle sizes and supporting up to 12 stacks of HBM...

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