The rapid development of AI, HPC, and other technologies is driving higher demands for semiconductor performance and energy efficiency. Traditional packaging technologies struggle to meet the needs of the AI era, creating an opportunity for advanced semiconductor packaging technologies to shine. ...

Korean memory giant Samsung has been working hard to prepare for supplying HBM3E to NVIDIA, but now it appears almost impossible to supply to NVIDIA in 2024. According to Wccftech's report, Samsung failed to secure a position in NVIDIA's supply chain because it couldn't meet NVIDIA's qualification t...

Marvell announces new custom HBM compute architecture that enables XPUs to achieve greater compute and memory density. According to its press release, this new AI accelerator (XPU) architecture enables up to 25% more compute, 33% greater memory while improving power efficiency. Notably, the new c...

According to a report from Central News Agency, the Office of the U.S. Trade Representative (USTR) announced today (11th) that the Biden administration will impose Section 301 tariffs on solar wafers, polycrystalline silicon and certain tungsten products imported from China. Citing a report from ...

Against the backdrop of the gradual recovery of the global semiconductor industry, China's chip design industry is expected to deliver double-digit growth this year, reaching total sales of RMB 646 billion (roughly USD 90.99 billion) in 2024, according to the Integrated Circuit Branch of the China S...