According to a report from TechNews, citing Tom’s Hardware, at its European Open Innovation Platform (OIP) Forum, TSMC announced that its ultra-large chip-on-wafer-on-substrate (CoWoS) packaging technology would be certified by 2027, featuring 9x reticle sizes and supporting up to 12 stacks of HBM...

According to a report by CNews, a prominent Russian high-tech industry news outlet, Vasily Shpak, Russia's Deputy Minister of Industry and Trade, announced at the Electronica Russia trade show in Moscow on October 26 that the Baikal series microprocessors, developed in Russia, have resumed supply. T...

美國經濟分析局於11月27日公布的數據顯示，聯準會高度關注的通膨指標再度回升。 美國PCE物價指數年增率為2.3%，較前一個月上升0.2個百分點；月增率為0.2%，與前一個月持平。核心PCE年增率為2.8%，較前一個月上升0.1個百分點�...

Following the footsteps of PC makers such as Dell and HP, which reportedly aim to reduce the number of components made in China as quickly as possible, a report by technowvoice suggests that American networking giant Cisco is also joining the ranks, as it has now prohibited suppliers from providing ...

Due to the fierce price competition in China’s automobile market, according to a report from Commercial Times, on the 27th, leading new energy vehicle (NEV) manufacturers BYD and SAIC Maxus have reportedly requested their suppliers to reduce prices by 10%. As many other companies may follow BYD's ...