According to a report from Reuters, citing The Information, the U.S. Department of Commerce has recently requested NVIDIA to investigate how its AI chips ended up in China over the past year. This request comes as part of ongoing efforts to enforce export control regulations and address potential un...

After finalizing the USD 7.86 billion funding award under U.S. CHIPS Act, Intel may be close to another business turnaround. According to Bloomberg, Team Blue has advanced several buyout firms to the next stage of bidding for Altera, its FPGA unit. A deadline for potential buyers to submit formal...

According to a report from India Today, a post by "Fixed Focus Digital" on the Chinese platform Weibo reveals that Apple might abandon its iPhone SE branding and rebrand it as “iPhone 16e.” Rumor has it that the smart phone is likely to be more aligned with the iPhone 16, such as in its camera a...

TSMC and Samsung are not just archrivals in the foundry market. They also confront each other in an emerging sector, the Fan-Out Panel-Level Packaging (FOPLP) technology. According to South Korean media outlet ETnews, the two semiconductor giants, while both eyeing FOPLP as a secret weapon to high-p...

As TSMC keeps advancing in the most cutting-edge nodes, its foundry peers in Taiwan may have to deal with multiple challenges. In addition to the price war launched by their Chinese rivals, Taiwanese foundries focusing on legacy nodes, including UMC and TSMC’s affiliate VIS, will face significantl...