Amid the booming demand for advanced packaging used in AI chips, TSMC Chairman C.C. Wei confirmed in the July earnings call that the company has been working on a mini production line for FOPLP (Fan-Out Panel Level Packaging), with achievements expected within three years. Now here’s the latest...

On December 18, Japan's leading NAND Flash manufacturer, Kioxia, debuted on the Tokyo Stock Exchange’s Prime Market with its Initial Public Offering (IPO). According to a report from MoneyDJ, citing Nikkei, Kioxia’s president, Nobuo Hayasaka, announced on December 19 that the company plans to ur...

According to a report from Reuters, citing The Information, the U.S. Department of Commerce has recently requested NVIDIA to investigate how its AI chips ended up in China over the past year. This request comes as part of ongoing efforts to enforce export control regulations and address potential un...

After finalizing the USD 7.86 billion funding award under U.S. CHIPS Act, Intel may be close to another business turnaround. According to Bloomberg, Team Blue has advanced several buyout firms to the next stage of bidding for Altera, its FPGA unit. A deadline for potential buyers to submit formal...

According to a report from India Today, a post by "Fixed Focus Digital" on the Chinese platform Weibo reveals that Apple might abandon its iPhone SE branding and rebrand it as “iPhone 16e.” Rumor has it that the smart phone is likely to be more aligned with the iPhone 16, such as in its camera a...