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2024-12-23

[News] ASML CEO Christophe Fouquet: U.S. EUV Export Ban Causes China’s Chip-Making to Lag by 10-15 Years

According to Liberty Times, ASML President and CEO Christophe Fouquet discussed geopolitical issues in the semiconductor industry and China lagging behind the West in chip manufacturing during an interview with the Dutch media outlet NRC. Regarding the U.S.'s ongoing restrictions on China's sem...

2024-12-23

[News] Foxconn Reportedly Secures the Lion’s Share for NVIDIA’s GB300, with New Products Set to Debut in 1H25

As NVIDIA is gradually ramping up AI servers based on the B200 and GB200 platforms, the U.S. chip giant is expected to unveil its next-gen GB300 AI server product line at the GTC conference in March, 2025. According to a report from the Economic Daily News, NVIDIA has preliminarily finalized the ord...

2024-12-23

[News] Semiconductor Silicon Wafer and Silicon Carbide Giants Build New Plants!

GlobalWafers Secures $406 Million Subsidy for Expanding Advanced 12-Inch Silicon Wafer Production On December 18, GlobalWafers, a leading semiconductor silicon wafer manufacturer, announced that its U.S. subsidiaries, GlobalWafers America (GWA) and MEMC LLC (MEMC), have received direct subsidies ...

2024-12-23

[News] U.S. and Australia Seek Countermeasures, Impact of China’s Critical Material Ban Expected to Wane in the Long Run

China has taken steps to assert state ownership over its rare earth materials necessary for semiconductor production by enacting a regulation that came into effect on October 1st. Also, the country's Ministry of Commerce announced on December 3rd that the export of dual-use items involving gallium, ...

2024-12-20

[News] SK hynix Rumored to Deliver Major HBM Order to Broadcom in 2025

While making strides in the HBM capacity expansion at its Cheongju M15X fab, SK hynix may have locked in another major client in addition to NVIDIA. According to South Korean media outlet The Elec, the memory giant has reportedly landed a substantial order to provide HBM to Broadcom. Sources cite...

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