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2025-02-21

[News] Nikon Aims to Close the Gap on ASML with New ArF Lithography System in FY28

As the semiconductor industry enters the Angstrom era, advanced node investments are increasingly dominated by tech giants. However, Japan’s Nikon aims to challenge this monopoly, planning to launch a new ArF immersion lithography system in FY2028 with improved compatibility with ASML’s products...

2025-02-20

[News] Building a Fab in the U.S. Reportedly Costs Double and Requires Twice the Time as in Taiwan

According to a report from MoneyDJ, citing Semiconductor Digest and Tom’s Hardware, building a semiconductor fab in the U.S. costs twice as much and takes twice as long as in Taiwan, as highlighted by Herbert Blaschitz, Executive Vice President at Exyte, a leading provider of engineering solutions...

2025-02-20

[News] Apple Unveils Its First In-House Modem, Moving Away from Qualcomm

For years, there have been rumors that Apple planned to develop its own modem chips to reduce reliance on Qualcomm and cut costs. According to its press release, the newly released iPhone 16e is equipped with the Apple C1, the company’s first self-developed cellular modem. As noted by a report ...

2025-02-20

[News] NVIDIA Reportedly Updates Policy, Requires Full Testing of HBM Stacks Before Shipping to Foundries

U.S. chip giant NVIDIA has reportedly updated its policy with memory suppliers, now requiring HBM stacks to be fully tested before being shipped to foundries for packaging, according to South Korean media outlet TheElec. The report indicates that HBM stacks from memory makers were previously sent...

2025-02-20

[News] Apple Unveils iPhone 16e: A Budget AI-Powered Smartphone, Replacing the SE Line

Apple unveiled the iPhone 16e, a new addition to the iPhone 16 series that is expected to replace the previous iPhone SE lineup. Its press release states that this product offers powerful Apple smartphone features at an affordable price. As noted in its press release, the iPhone 16e comes with th...

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