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2025-03-10

[News] Samsung Reportedly Develops Glass Interposers for Packaging, Leveraging Corning’s Glass

According to a report from Business Korea, citing SEDaily, Samsung Electronics’ Device Solutions (DS) division has begun developing “glass interposers,” a next-generation packaging material. The goal is not only to replace the expensive silicon interposers but also to enhance performance. M...

2025-03-07

[News] Samsung Reportedly Joins Broadcom on Silicon Photonics, with Commercialization Expected in 2 Years

While Taiwanese foundry giant TSMC reportedly making strides in silicon photonics by securing NVIDIA as one of its first customers, Samsung is said to have teamed up with Broadcom on the technology, according to the Chosun Daily. Industry sources cited by the Chosun Daily suggest that Samsung pla...

2025-03-07

[News] SanDisk to Raise NAND Prices Over 10% from April 1, Signaling Market Rebound

While memory giants like Samsung and SK hynix are reportedly reducing NAND production due to oversupply, the market condition seems to be nearing its bottom. According to a report from TechNews, SanDisk will implement prices increases of over 10% starting April 1. According to SanDisk’s announc...

2025-03-07

[News] Intel Reportedly Has 30% Wafers Outsourced, Hails TSMC as a Great Supplier

While Intel pushes ahead with its 18A and advanced node roadmaps, the company’s ambition to boost its foundry business appears evident. However, according to Tom’s Hardware and information provided by Seeking Alpha, as the company initially aimed to eliminate its reliance on TSMC a year ago, it ...

2025-03-07

[News] HPE to Cut 2,500 Jobs as Server Profits Drop and Revenue Falls Short of Estimates

According to a report from ijiwei, citing CNBC and Reuters, Hewlett Packard Enterprise (HPE) has announced a layoff plan. The report states that HPE will lay off 2,500 employees in the next 18 months, accounting for approximately 5% of its workforce, including expected attrition. As of October 31, t...

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