As TSMC preps for 2nm mass production in the second half of 2025, it is also accelerating advanced packaging expansion to meet strong demand, with a shifting focus beyond CoWoS. According to Commercial Times, NVIDIA’s next-gen Rubin GPU will join AMD and Apple in adopting TSMC’s SoIC (System on ...

As China seeks to cut reliance on Western chipmaking machines such as extreme ultraviolet (EUV) lithography systems, the country has been pushing existing deep ultraviolet lithography (DUV) to its limits. According to Bloomberg and South China Morning Post, Huawei-linked SiCarrier may enable domesti...

On March 18, TCL Technology announced that its subsidiary, TCL CSOT, had completed the industrial and commercial registration changes for the acquisition of 80% equity in LG Display (China) Co., Ltd. (hereinafter referred to as "LGDCA") and 100% equity in LG Display (Guangzhou) Co., Ltd. (hereinafte...

 “The era of Physical AI is here!” With this announcement at CES 2025, NVIDIA founder Jensen Huang heralded a pivotal step forward in the fields of AI and robotics, making them the key focus of the tech sector this year. P.K. Tseng, Research Manager at TrendForce, has noted that compared to ...

Malaysia is planning to strengthen its semiconductor regulations in response to U.S. pressure, aiming to curb the transfer of advanced AI chips to China, as noted by a report from The Edge Malaysia, citing Financial Times. According to the report, Malaysia’s Trade Minister stated that the U.S. ...